Roadmap 2026–2027
Next-gen silicon, already on the roadmap
AMD MI35X Series and NVIDIA BLACKWELL Series arrive at TATC's Thailand data centre — reserved in priority order for early customers.
AMD
Coming SoonAMD MI35X Series
AMD Instinct MI355
288GB HBM3e CDNA 4 — coming to TATC bare metal
Memory
288GB HBM3e
Bandwidth
8 TB/s
TDP
1000W
- Industry-leading 288GB HBM3e per card
- Native FP4 datapath for next-generation frontier inference
- ROCm 6.x full-stack — CUDA model migration supported by our engineers
Specifications finalising with the vendor — figures marked "TBC / est." will be confirmed at announcement.
NVIDIA
Coming SoonNVIDIA BLACKWELL Series
NVIDIA B300
288GB HBM3e Blackwell Ultra — coming to TATC bare metal
Memory
288GB HBM3e
Bandwidth
8 TB/s
TDP
~1400W
- High-capacity 288GB HBM3e unified memory per accelerator
- Next-generation NVLink 5 scale-out (specs TBC)
- Full CUDA ecosystem with TensorRT-LLM inference
Specifications finalising with the vendor — figures marked "TBC / est." will be confirmed at announcement.
Why book early
Priority allocation for early customers
New accelerator supply is tight regionally. Customers who reserve capacity today get first-node allocation, co-designed configurations and locked pricing for the launch window.
Building for the next generation?
Tell us your target model size and context length — we'll match you to the first node that fits.